UCSD Layoff from Career Appointment: Apply by 05/18/21 for consideration with preference for rehire. All layoff applicants should contact their Employment Advisor.
Special Selection Applicants: Apply by 05/27/21. Eligible Special Selection clients should contact their Disability Counselor for assistance.
Job posting will remain open until position is filled.
Reporting to the Facility Director, the Principal Equipment Engineer utilizes advanced engineering concepts and aligned with campus objectives to lead the work of an engineering team in charge of the integration of micro/nanofabrication processes and advanced equipment, with a particular focus on setting up and optimizing fabrication and characterization tools to meet the stringent requirements for cutting-edge device applications. Works closely with the facility's equipment engineering and process engineering teams and serves as the go-to person for challenging cleanroom equipment problems.
The incumbent plays an instrumental role in the success and growth of the overall operation, works in close coordination with and advises the facility technical director and faculty director to establish the operation's core capabilities. Primary responsibilities include inspecting, testing, installing, troubleshooting, repairing, maintaining, and upgrading highly sophisticated, high-value equipment for micro- and nanofabrication for the Nano 3 micro- and nanofabrication cleanroom facility, a major, centralized campus recharge at the Qualcomm Institute, currently serving over 600 individual users from over 150 campus research groups and over 120 industrial companies. Regularly works on highly complex issues where analysis of situations or data requires an in-depth evaluation of variable factors. Exercises independent judgment in selecting methods, techniques, and evaluation criteria for obtaining results.
The engineer collaborates with Principal Investigators (PIs) and other researchers in the design of experiments to maximize the full design capabilities of the instruments. Provides engineering services to PIs and design and instrument modification to meet the experimental research needs of the PIs. Leads members of the equipment/processing teams and provides recommendations for organizational planning of the teams to higher-level management.
Advanced degree in Engineering or a related field and typically seven (7) years experience working with semiconductor device fabrication and analysis processes, including industry experience in a research and development environment and/or pilot manufacturing, and/or equivalent experience/training.
Advanced knowledge associated with the planning, development, and fabrication of engineering systems.
Thorough knowledge of specialized design work as well as the overall field.
Strong creativity and problem solving abilities to apply principles, practices and procedures within discipline to complete difficult assignments.
Strong project management skills needed to assume responsibility for accomplishment of research objectives.
Excellent communication skills, both written and verbal, to convey complex information in a clear and concise manner. Advanced interpersonal and presentation skills.
Demonstrated ability to lead, motivate and influence others. Experience in providing work direction, supervising and training to staff.
Knowledge in power system and power electronics to set up and keep cool various types of processing equipment with specific voltage and current requirements (equipment may consume a significant amount of power (e.g. >20KW for a furnace). Advanced knowledge and experience in handling plasma and RF systems.
Knowledge in UV optics to install, calibrate, diagnose, maintain, and repair contact mask aligners for photolithography which operate at different UV wavelengths and have different optical designs.
Vacuum electronics. Knowledge in vacuum electronics to maintain both SEM and E-beam lithography machines, field emitters and electronic lenses, which are used to generate, direct, and focus electron beams.
Advanced knowledge of highly sophisticated etching systems. Extensive practical knowledge to handle all types of toxic, corrosive, and explosive gases such as silane, chlorine, phosphine, arsine, etc. used in various dry etching and plasma systems.
Demonstrated knowledge of and ability to install and maintain sophisticated automatic or robotic mechanic sample transfer and loading systems of etching and vacuum equipment.
Detailed theoretical knowledge and extensive experience with electronics and sensors to monitor and
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