Processing trouble shooting and problem solving. Processing optimization and development of process for new products.
Responsible for wafer process control.
Trouble shooting and problem solving in the area of photolithography, dry and wet etch, metalization, lap & polish, PECVD, ICPCVD, dicing and cleaving, facet coating.
Improvement and development of device process in above area for new products.
Characterization such as Ellipsometer, Spectrometer, Four-point probe, Profilometer.
Provide training to operators for new processing procedures.
Assist Operators and Technicians where needed.
Check device performance.
Bachelor or M.S. degree in Physics, Electrical Engineering or related field. Basic knowledge of semiconductor lasers. Chemical etch, thin film deposition and characterization experience required. Strong analytical skills for trouble shooting and problem solving. Must be able to work in class 1000 clean room. Work with various chemicals. Willing to wear Clean Room Attire duration of the time in the clean room. Willing to wear chemical protection gear duration of the time work on chemicals.
[NOTE: The above statements are intended to describe the general nature and level of work being performed by people assigned to this classification. They are not to be construed as an exhaustive list of all responsibilities, duties, and skills required of personnel so classified. All personnel may be required to perform duties outside of their normal responsibilities from time to time, as needed.]