| • The position is responsible for the development of new packaging technologies for high-speed Transmitter Optics Sub-assembly (TOSA) and Receiver Optics Sub-Assembly (ROSA). This includes theoretical modeling, material evaluation, building prototypes, performing validation testing, analyzing data, and assisting in transferring the new designs to production. • Work closely with chip and transceiver development teams to define specifications and evaluate product performance. • Work with vendors on design and specification of material/subcomponents. • This position is also responsible for developing test beds for TOSA/ROSAs and transceiver modules. |
|• Ph.D or M.S. in electrical engineering, physics, or related field. • Direct experience with photonic integration technologies. • Solid understanding of optoelectronic devices (lasers, modulators, photodetectors), RF electronics (transmission lines, modulation response, impedance matching), and optics (e.g. coupling between devices and optical fiber). • Experience with detailed modeling of thermal, electrical, and optical properties of optoelectronics devices, both DC and RF performance. • Good understanding of transceiver design. • Design of experiments and data analysis. • Software programming for automatic testing stations. |
Employer will assist with relocation costs.
Additional Salary Information: competitive
Internal Number: 537
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