Inphenix is a world-leading manufacturer for Superluminescent Diodes (SLDs), Semiconductor Optical Amplifiers (SOAs), broadband light sources and lasers which cover wavelength range from 700nm to 1700nm. Inphenix offers products from chip-level to module and subsystem-level.
Inphenix is a vertically integrated supplier with a 10,000 square foot Class 10 clean room for MOCVD epitaxial growth, wafer fabrication and chip processing and a 20,000 square foot packaging area for hermetically sealed packaging and testing. Inphenix’s full front-end to back-end capability insures fast delivery and expedited customized design needs. Our markets are biomedical, telecom, sensor, industrial and test & measurement.
We are conveniently located off HWY 580 in Livermore.
Design and develop new package scheme for opto-electronic devices with improved footprint and free space laser alignment for products.
Work with quality and operations to ensure consistency in packaging standards.
Proactively improve and optimize the quality and performance of existing core products.
Monitor packaging design and quality issues and assist in developing and implementing packaging development procedures.
Additional duties and projects as assigned.
BS or MS in Opto-Electronics Engineering or Mechanical Engineering or equivalent in education and experience.
Minimum 2 years of packaging experience with at least one package design that has been transferred to manufacturing.
Minimum of 2 years of opto-electronics engineering industry experience required.
Experience with engineering tools for fiber alignment, wire bonding, flip-chip bonding and opto-electronic device assembling.
Able to prioritize tasks based on business needs.
Experience with Autocad/Solid State mechanical design software programs.